CHEMICAL SOLUTIONS
For LED/Semiconductor process
We develop and provide the most efficiently customized oil and water base diamond slurries
OIL/WATER BASE DIAMOND SLURRIES
DIAMOND TYPE : MONO, POLY, BLAST
Possible diamond powder size : 1.5-20um
POLISHING FOR SAPPHIRE WAFER AND
CERAMIC BASE PARTS
VISCOSTY, DIAMOND DISTRIBUTION RATE
CONTROL
OFFERING ANY CUMSTOMIZED
PRODUCTS
| Size | Median (D50) | Upper Limit (D99) |
|---|---|---|
| 2-4 μm | 3.12 μm | 6.20 μm |
| 3-6 μm | 4.27 μm | 8.29 μm |
| 3-7 μm | 5.17 μm | 10.02 μm |
| 4-8 μm | 6.38 μm | 12.3 μm |
Wafer Backside Condition Before/After Polishing
LASER DICING COATING SOLUTION
Water soluble material
Wafer surface spin coated before laser cutting
Easily cleaned with D.I. water
Stable coating layer
No debris and hazardous materials after laser cutting
SURFACTANT
Protect wafer from corrosion and particle contamination.
Reducing chipping and crack, improving blade life time Low consumption by dilution
