TCB (Thermal Compression Bonding) TOOLS

For semiconductor chip attach process

We provide precisely customized TCB bonding tools with high thermal conductivity AlN

이미지
Requirements Our Strength
Thermal conductivity High thermal conductivity (≥ 180W/mK) -> Working efficiency
Hardness Over 1200 Hv -> Long life time
Dimension Within ±10um For better Placement accuracy
Flatness Under 2um -> Stability for Bump soldering uniformity
Thermal Expansion Under 5ppm < 1000 °C For better placement accuracy
이미지
General Product ROOTS TC Bonding Tool
Flatness Parallelization Flatness Parallelization
Top 2.0um - 1.8um -
Bottom - 2.0um - 1.7um
이미지
ROOTS TC Bonding Tool
Flatness Parallelization
Side A - 1.0um
Side B 1.0um 1.9um