PIG: Phosphor In Glass
Our PiG (Phosphor in Glass) products, which we develop and manufacture, are designed for high-power, high-reliability lighting applications such as automotive headlights, medical lights, projectors, etc.. Unlike liquid silicone-based phosphors like PiS (Phosphor in Silicone), which are used in medium and low-power applications such as general lighting, our PiG technology is optimized for these more demanding environments
APPLICATIONS
Phosphor in Glass
LEDChip
Substrate
LED PACKAGE STRUCTURE
SUITABLE APPLICATIONS
Automobile Exterior Lights
High Reliability Lights
VOC Free Lighting Products
STRENGTH POINTS
ALL IN-HOUSE PROCESS
PRECISE DIMENSION CONTROL
100% CHIP QUALITY INSPECTION
100% COLOR INSPECTION
NO CHIPPING ON SUFACE EDGE
ALL IN-HOUSE PROCESS
WAFER FABRICATION
GLASS, PHOSPHOR MIXING
1ST SINTERING
2ND GPS SINTERING
PiG CHIP FABRICATION
WAFER GRINDING / POLISHING
PIG DICING
SORTING (BINNING)
QUALITY INSPECTION
AUTOMATED VISUAL INSPECTION
TARGET COLOR INSPECTION
VISUAL INSPECTION
PIG DEVELOPMENT
We possess proprietary technology for the production of PiG (Phosphor in Glass).
Based on this, we are capable of developing and manufacturing ultrs-small and ultra-thin PiG. Additionally, we can produce PiG in various forms. We are open to collaborating with customers on new development projects that lead the market.
ULTRA SMALL AND THIN PiG
Size: Min. 450㎛, Thickness: Min. 50㎛
Small form factor LED packages and Multi-beam headlight applications
SMALL SIZE PiG (TOP VIEW)
THIN PiG (SIDE VIEW)
SIDE ANGLE CUT PiG
For all chip sizes, different angle-cut shapes are available for customers' LED applications
Improving light concentration and straightness
Customization for thickness(T), angle(A), and length(L) is available
REFLECTION EDGE PiG
For all chip size, Edge thickness: Around 50㎛
Prevent optical interference between LEDs in mult-light applications
OUT CUT EDGE PiG
For wire bonding LED packages
